Substrate alignment method and apparatus

Details Substrate alignment method and apparatus Substrate alignment method and apparatus

2006-01-10

2006-01-10

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With control means responsive to sensed condition

C228S009000, C228S010000, C228S012000, C228S102000, C228S105000

Reexamination Certificate

active

06983872

ABSTRACT:
The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

REFERENCES:
patent: 5831247 (1998-11-01), Hidaka
patent: 6276590 (2001-08-01), Nakazato
patent: 6315185 (2001-11-01), Kajii
patent: 6355298 (2002-03-01), Wah et al.
patent: 6564991 (2003-05-01), Kinoshita
patent: 6575351 (2003-06-01), Kobayashi et al.
patent: 6685080 (2004-02-01), Kee et al.
patent: 2004/0253748 (2004-12-01), Neo et al.

Affiliated with

Also associated with

Rating

Substrate alignment method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate alignment method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate alignment method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3581305