Substrate adjuster, substrate holder and substrate holding metho

Photocopying – Projection printing and copying cameras – Detailed holder for photosensitive paper

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Details

355 53, 355 55, 356400, G03B 2760, G03B 2472, G03B 2752, G01B 1100

Patent

active

061375624

ABSTRACT:
When a relatively thin substrate, such as a silicon wafer, is used in an exposure apparatus, a substrate adjuster is inserted between the thin substrate and the substrate holder in order to raise the position of the top surface of the thin wafer. The substrate adjuster is selected so that the sum of the thicknesses of the substrate adjuster and the thin substrate lies within the range of thicknesses of ordinarily used substrates. If a relatively thick substrate, for example, a ceramic substrate, is used, the substrate is directly held on the substrate holder without using the substrate adjuster. The substrate holder holds the substrate adjuster through vacuum adsorption, which also helps the substrate be adsorbed onto the substrate adjuster. In this manner, different substrates having different thicknesses can be used in the exposure apparatus without exchanging the substrate holder.

REFERENCES:
patent: 5563683 (1996-10-01), Kamiya
patent: 5563684 (1996-10-01), Stagaman
patent: 5717482 (1998-02-01), Akutsu et al.

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