Substrate, a module and a method for fastening components of the

Electric heating – Heating devices – Combined with diverse-type art device

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H05B 100

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059549785

ABSTRACT:
Module-forming component secured to a substrate using heat activated bonding arrangements are made by resistance heating the bonding medium, for example solder, thermal activated adhesive or thermoplastic material, using electrically energized resistance elements, for example thick film resistance layers, secured to the side of the substrate opposite the side on which the components are secured.

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