Subsonic to supersonic and ultrasonic conditioning of a polishin

Abrading – Machine – Combined

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Details

451 91, 451443, B24C 500, B24B 5500

Patent

active

058686088

ABSTRACT:
The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.

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