Subpad having robust, sealed edges

Abrading – Flexible-member tool – per se

Reexamination Certificate

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Details

C451S530000, C451S533000, C451S296000

Reexamination Certificate

active

10273194

ABSTRACT:
Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

REFERENCES:
patent: 6123609 (2000-09-01), Satou
patent: 6126532 (2000-10-01), Sevilla et al.
patent: 6368197 (2002-04-01), Elledge
patent: 6413873 (2002-07-01), Li et al.
patent: 6439968 (2002-08-01), Obeng
patent: 6464576 (2002-10-01), Freeman et al.
patent: 6485359 (2002-11-01), Li et al.
patent: 6491570 (2002-12-01), Sommer et al.
patent: 6561889 (2003-05-01), Xu et al.
patent: 6613200 (2003-09-01), Li et al.
patent: 6733373 (2004-05-01), Yang et al.
patent: WO 01/15864 (2000-08-01), None
patent: WO 01/83167 (2001-05-01), None

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