Submount substrate for mounting light emitting device and...

Details Submount substrate for mounting light emitting device and... Submount substrate for mounting light emitting device and...

2008-05-13

2008-05-13

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257SE33005, C257SE33062, C257SE33066

Reexamination Certificate

active

11174640

ABSTRACT:
A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.

REFERENCES:
patent: 6492685 (2002-12-01), Koyama et al.
patent: 7229859 (2007-06-01), Yudasaka et al.
patent: 2004/0206970 (2004-10-01), Martin
patent: 2006/0091403 (2006-05-01), Chang et al.
patent: 2006/0175621 (2006-08-01), Ohtsuka et al.

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