Submount, pedestal, and bond wire assembly for a transistor...

Coherent light generators – Particular temperature control – Heat sink

Reexamination Certificate

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C257S706000, C257S707000

Reexamination Certificate

active

10393218

ABSTRACT:
The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the submount is connected to a top surface of the pedestal. Each bond wire in a bond wire set is connected to a position on the top surface of the submount, and to a position on the signal line. The signal line is positioned a first distance from the position on the top surface of the submount and a second distance from the pedestal. The submount is sized such that a portion of the bottom and the top surface of the submount extends beyond the top surface of the pedestal such that the first distance is less than the second distance.

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