Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
2002-02-08
2004-09-28
Patel, Ashok (Department: 2879)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
Reexamination Certificate
active
06796723
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a submount for an opto-electronic module and a packaging method using the same, and more particularly, to a submount for an opto-electronic module suitable for high-speed transmission and a packaging method using the same.
2. Description of the Related Art
Recently, as the demand for high-quality communication service increases sharply, the transmission speed of optical communication systems becomes very rapid. Now, it is possible to build a comprehensive network having an ultrahigh speed broad-band width using opto-electronic modules having a unit transmission speed of 2.5 Gbps in systems having a transmission speed of about 40-100 Gbps by Wavelength Division Multiplexing (WDM). However, opto-electronic modules having the minimum unit transmission speed of 10 Gbps are required to increase the efficiency of the configuration of optical communication systems having a transmission speed of 160-640 Gbps.
FIG. 1
is an exploded perspective view of a general photo-receiver module including a general submount for an opto-electronic module. Referring to
FIG. 1
, a submount
104
, to which an opto-electronic device
102
such as a photodiode sticks, is attached to a substrate
106
. The submount
104
electrically connects the opto-electronic device
102
to an electronic device (not shown) on the substrate
106
using wires or ribbon bonding. A plurality of signal lines
108
are installed on the substrate
106
for such electrical connection. An amplifier
110
for amplifying an electrical signal output from the opto-electronic device
102
to a predetermined level or above is attached to the substrate
106
. The amplifier
110
electrically contacts the plurality of signal lines
108
on the substrate
106
. The substrate
106
, to which the submount
104
and the amplifier
110
are attached, is put into a metal shield case
112
and then the metal shield case
112
is covered with a cover
113
. An optical fiber
114
, which forms a path of light incident on the opto-electronic device
102
, penetrates through the metal shield case
112
and is aligned with the opto-electronic device
102
so that light is properly incident on the opto-electronic device
102
. For this, a fiber support
116
is attached to the substrate
106
to support the optical fiber
114
.
In this general photo-receiver module, the submount
104
is connected to the electronic device (not shown) mainly using bonding wires. However, if the general photo-receiver module having the above-described configuration is a photo-receiver module having a transmission speed of 2.5 Gbps or more, signal distortion occurs on interconnection lines between the opto-electronic device
102
and the electronic device (not shown) due to parasitic components of the bonding wires. As a result, the reliability of signal transmission and the reliability of module operation are reduced. Moreover, there is a limit in that additional interconnection lines installed on the submount
104
are not used in a photo-receiver module requiring high-speed operation of over 2.5 Gbps.
SUMMARY OF THE INVENTION
To solve the above-described problems, it is a first object of the present invention to provide a submount for an opto-electronic module suitable for high-speed transmission of over 2.5 Gbps.
It is a second object of the present invention to provide a packaging method using the submount for an opto-electronic module.
Accordingly, to achieve the first object, there is provided a submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal. The submount includes a dielectric material having a polygonal shape with a front face and a bottom face, and an interconnection line having a coplanar waveguide structure, attached to the front face and the bottom face of the dielectric material, and electrically connected to the opto-electronic device to output signals from the opto-electronic device.
It is preferable that the interconnection line having a coplanar waveguide structure includes a plurality of interconnection lines, which are spaced apart from each other. The the interconnection lines may be a first ground line, a signal transmission line, a second ground line, and a bias application line, respectively, which are sequentially disposed. It is preferable that the the opto-electronic device is attached to a portion of the second ground line, which is attached to the front face of the dielectric material. The opto-electronic device attached to the second ground line is preferably connected to the signal transmission line and the bias application line via wires.
It is preferable that the distance between a portion of the signal transmission line and a portion of the second ground line on the bottom face of the dielectric material is greater than the distance between a portion of the signal transmission line and a portion of the second ground line on the front face of the dielectric material.
To achieve the second object, there is provided a packaging method using a submount for an opto-electronic module including a dielectric material and an interconnection line having a coplanar waveguide structure. An opto-electronic device is attached to the interconnection line to be electrically connected to the interconnection line. The interconnection line, to which the opto-electronic device is attached, is attached to a conductive interconnection line of a substrate.
Attaching the interconnection line to the conductive interconnection line of the substrate is performed using conductive epoxy.
REFERENCES:
patent: 4707067 (1987-11-01), Haberland et al.
patent: 5179609 (1993-01-01), Blonder et al.
patent: 5222175 (1993-06-01), Tatoh
patent: 5909523 (1999-06-01), Sakaino et al.
patent: 6072815 (2000-06-01), Peterson
patent: 6240113 (2001-05-01), Peterson
patent: 6403948 (2002-06-01), Tachigori
Kim Hae-cheon
Kim Sung-il
Lim Jong-won
Electronics and Telecommunications Research Institute
Macchiarolo Peter
Patel Ashok
LandOfFree
Submount for opto-electronic module and packaging method... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Submount for opto-electronic module and packaging method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Submount for opto-electronic module and packaging method... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3250861