Submount for mounting semiconductor device

Details Submount for mounting semiconductor device Submount for mounting semiconductor device

2007-11-20

2007-11-20

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23023, C257SE23026, C257SE21509

Reexamination Certificate

active

10506510

ABSTRACT:
A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount3comprises (a) a substrate4; and (b) a solder layer8formed on the top surface4fof the substrate4. The solder layer8before melting has a surface roughness, Ra, of at most 0.18 μm. It is more desirable that the solder layer8before melting have a surface roughness, Ra, of at most 0.15 μm, yet more desirably at most 0.10 μm. A semiconductor unit1comprises the submount3and a laser diode2mounted on the solder layer8of the submount3.

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