Submount

Details Submount Submount

1996-07-12

1998-06-23

Ledynh, Bot L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29852, 361795, H01R 909

Patent

active

057708215

ABSTRACT:
A submount including:

REFERENCES:
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4942076 (1990-07-01), Panicker et al.
patent: 4947238 (1990-08-01), Ishii et al.
patent: 5125962 (1992-06-01), Krentscher
patent: 5316975 (1994-05-01), Maeda
patent: 5340947 (1994-08-01), Credle et al.
patent: 5429670 (1995-07-01), Miyoshi
patent: 5529852 (1996-06-01), Sasame et al.
patent: 5561322 (1996-10-01), Wilson
patent: 5587111 (1996-12-01), Watanabe et al.
patent: 5661089 (1997-08-01), Wilson

Affiliated with

Also associated with

Rating

Submount does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Submount, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Submount will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1396245