Submillimeter laser measurement of water or filler content of sh

Radiant energy – Invisible radiant energy responsive electric signalling – With means to inspect passive solid objects

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2503591, 250339, G01F 2300

Patent

active

047851856

ABSTRACT:
A method and apparatus for detecting the moisture or filler content of dielectric material is disclosed which utilizes a submillimeter laser source of radiation scanned across the face of the material. A plurality of detectors, placed on the side of the material opposite the laser, supplies the material transmittance information to a microcomputer for calculating the moisture or filler content of the material. When thin dielectric materials and/or continuous scanning are utilized the submillimeter laser is pumped by a single CW (continuous wave) CO.sub.2 laser and when thicker dielectrics are measured with discrete pulses the submillimeter laser is pumped by a single TEA (Transversely Excited Atmospheric) CO.sub.2 laser. Depending on the transmission properties of the environment in which the apparatus operates, either the submillimeter laser beam or the infrared pump laser beam can be transmitted through the medium surrounding the apparatus in order to minimize pre-measurement attenuation of the beam.

REFERENCES:
patent: 3597616 (1971-08-01), Brunton et al.
patent: 4450356 (1984-05-01), Murray et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Submillimeter laser measurement of water or filler content of sh does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Submillimeter laser measurement of water or filler content of sh, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Submillimeter laser measurement of water or filler content of sh will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1104976

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.