Submicron particle removal using liquid nitrogen

Details Submicron particle removal using liquid nitrogen Submicron particle removal using liquid nitrogen

1993-04-26

1995-10-10

Simmons, David A.

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

134 31, 134 34, 134902, B08B 704

Patent

active

054567580

ABSTRACT:
Liquid nitrogen is introduced onto a surface of a semiconductor wafer to remove submicron particles from its surface. LN.sub.2 flows across the wafer surface wherein the surface tension of the liquid collects contaminant particles and removes them off the edge of the wafer.

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"Ice Scrubber Cleaning", Toshiaka Ohmori et al., Technical Proceedings Semicon/Kansai-Kyoto, Jun. 21-23, 1990, pp. 142-149.

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