Submicron conductor manufacturing

Details Submicron conductor manufacturing Submicron conductor manufacturing

1984-02-23

1985-09-24

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29579, 29591, 29576B, 148 15, 357 22, 357 65, 427 89, 427 99, 427 91, 156651, H01L 2128, H01L 21283, H01L 21302

Patent

active

045425779

ABSTRACT:
A submicron conductor is formed by placing a metal member over an insulator both terminating at a common defined edge. An angularly deposited metal against the edge provides a broad metal conductor attached along the entire edge of a thin metal member which is positioned on the substrate on a narrow line with the width defined by the horizontal component of the angular deposition. A removal operation removes with respect to the vertical component of the angular deposition the excess angularly deposited metal and leaves a vertical, very narrow metal conductor having a horizontal metal over the dielectric in electrical and supporting contact along the entire length. The asymmetry of the conductor provides field effect transistor advantages.

REFERENCES:
patent: 3387360 (1968-06-01), Nakamura et al.
patent: 3914857 (1975-10-01), Goser et al.
patent: 3967365 (1976-07-01), Friedrich
patent: 4232439 (1980-11-01), Shibata
patent: 4280854 (1981-07-01), Shibata et al.
patent: 4354896 (1982-10-01), Hunter et al.
patent: 4358340 (1982-11-01), Fu
Speidell "A Simple Method for Fabricating Submicron Lines" J. Vac. Sch. Technol, 19(3), Sep./Oct. 1981, pp. 693-695.

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