Submerge chemical-mechanical polishing

Details Submerge chemical-mechanical polishing Submerge chemical-mechanical polishing

1999-11-19

2001-03-20

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S041000, C451S285000, C451S287000, C451S288000, C451S446000

Reexamination Certificate

active

06203412

ABSTRACT:

BACKGROUND OF THE INVENTION
(1) Field of the Invention
The invention relates to a method of polishing in the fabrication of integrated circuits, and more particularly, to a method of improved chemical-mechanical polishing in the manufacture of integrated circuits.
(2) Description of the Prior Art
Chemical-mechanical polishing is used in the art for global planarization of dielectric layers as well as metal layers. A polishing pad having a roughened surface is used to planarize the wafer. During polishing, slurry is used (directly and indirectly) to polish the wafer. After the polishing pad has been used to polish a number of wafers, its surface becomes flattened. The surface can again be roughened by a process known as conditioning. For example, a diamond-embedded wheel or dresser is applied to the pad while the polishing table continues to rotate. Another function of the slurry is to remove particles or any foreign object from the polishing table. Due to the cost of the slurry, the process will call for a minimum amount of slurry to be used during polishing. This is fine when it is used to removed particles, but ineffective when used to remove diamond bits that have fallen off the dresser as the dresser's diamond bits are too heavy to be washed away by the slurry. The diamond bits remaining on the polishing table will scratch the wafers. It is desired to find a process that will remove the heavy particles such as diamond bits from the polishing table.
U.S. Pat. No. 5,885,147 to Kreager et al discloses an apparatus for conditioning a polishing pad. For example, the apparatus may comprise diamond particles. U.S. Pat. No. 5,830,043 to Aaron et al shows a CMP apparatus with built-in pad conditioner. U.S. Pat. No. 5,791,970 to Yueh discloses a slurry recycling system wherein a funnel collects slurry flowing off the platen and filters it for recycling. U.S. Pat. No. 5,709,593 to Guthrie et al discloses a CMP tool with a slurry distribution system. U.S. Pat. No. 5,897,425 to Fisher, Jr. et al shows a vertical polishing device to remove contaminants that may scratch the wafer. U.S. Pat. No. 5,605,499 teaches a CMP process using a two-layer polishing cloth for polishing an interlevel dielectric layer.
SUMMARY OF THE INVENTION
A principal object of the present invention is to provide an effective and very manufacturable method of chemical mechanical polishing.
Another object of the invention is to provide a method of chemical mechanical polishing that avoids scratching of the wafer.
Yet another object is to provide a method of chemical mechanical polishing that avoids scratching of the wafer by removing large particles from the polishing table.
A still further object of the invention is to provide a method of chemical mechanical polishing using a submerged polishing table and high flushing rate to remove large particles from the polishing table.
A still further object of the invention is to provide a method of chemical mechanical polishing using a submerged polishing table and high flushing rate to avoid scratching of the wafer by removing large particles from the polishing table.
Yet another object of the invention is to provide a method of chemical mechanical polishing using a submerged polishing table and a high velocity pump and filters to recycle the slurry.
In accordance with the objects of this invention a new method of chemical mechanical polishing using a submerged polishing table is achieved. A polishing table is provided having a polishing pad thereon wherein the polishing table is fixed within a container. A channel exists between an outer edge of the polishing table and an inner edge of the container. Outlets lie in a bottom surface of the channel. A wafer carrier presses a wafer onto the polishing pad. Slurry is dispensed onto the polishing pad at a high rate wherein the slurry polishes the wafer and wherein the slurry flushes away particles from a surface of the polishing pad into the container and out through the outlets. Even heavy particles such as diamond bits from a diamond-embedded dresser on the polishing pad can be flushed away using the method and polishing table of the invention.


REFERENCES:
patent: 5605499 (1997-02-01), Sugiyama et al.
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5755614 (1998-05-01), Adams et al.
patent: 5791970 (1998-08-01), Yueh
patent: 5830043 (1998-11-01), Aaron et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5886147 (1999-03-01), Kreager et al.
patent: 5897425 (1999-04-01), Fisher, Jr. et al.
patent: 6106728 (2000-08-01), Iida et al.

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