Sub-mount, light emitting diode package and manufacturing...

Details Sub-mount, light emitting diode package and manufacturing... Sub-mount, light emitting diode package and manufacturing...

2011-06-14

2011-06-14

Estrada, Michelle (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S446000, C257SE25032, C349S058000, C349S138000

Reexamination Certificate

active

07960806

ABSTRACT:
A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.

REFERENCES:
patent: 6936855 (2005-08-01), Harrah
patent: 7723730 (2010-05-01), Groetsch et al.
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 2006/0284190 (2006-12-01), Zimmerman et al.
patent: 2008/0099770 (2008-05-01), Mendendorp et al.
patent: 2010/0071936 (2010-03-01), Tan
patent: 1987-226645 (1987-10-01), None
patent: 2006-087620 (2006-08-01), None
Korean Office Action dated Dec. 7, 2009 and issued in corresponding Korean Patent Application No. 10-2008-0035521.

Affiliated with

Also associated with

Rating

Sub-mount, light emitting diode package and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sub-mount, light emitting diode package and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sub-mount, light emitting diode package and manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2714914