Sub-module conformal electromagnetic interference shield

Details Sub-module conformal electromagnetic interference shield Sub-module conformal electromagnetic interference shield

2006-05-17

2011-11-22

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S127000

Reexamination Certificate

active

08062930

ABSTRACT:
The present invention relates to a manufacturing process of a sub-module having an electromagnetic shield. Initially, a meta-module having circuitry for two or more sub-modules is formed. An overmold body is placed over the circuitry for all of the sub-modules. The overmold body of the meta-module is sub-diced to expose a metallic layer grid around each of the sub-modules. Next, an electromagnetic shield is applied to the exterior surface of the overmold body of each of the sub-modules and in contact with the metallic layer grid. The meta-module is then singulated to form modules having two or more sub-modules.

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