Sub-micron adjustable mount for supporting a component and...

Electric heating – Metal heating – For bonding with pressure

Reexamination Certificate

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C219S086900, C219S119000, C219S056210, C219S056220

Reexamination Certificate

active

07126078

ABSTRACT:
An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for use in forming a weld having a target set of weld parameters. An electrode passage is defined in a biasing force arrangement supporting at least a portion of the length of an elongated, flexible electrode and to limit lateral movement sufficient to transfer at least a portion of a resilient force to the electrode tip so that the tip resiliently contacts the weld region. The electrode passage limits induced lateral flexing to an extent which transfers an amount of the resilient force to the first end portion of the electrode that is sufficient to provide for formation of a weld between the support arrangement and the workpiece.

REFERENCES:
patent: 2045523 (1936-06-01), Fassler
patent: 3435181 (1969-03-01), Walkow
patent: 4030811 (1977-06-01), Khoe et al.
patent: 4208568 (1980-06-01), Bakewicz et al.
patent: 4237474 (1980-12-01), Ladany
patent: 4447700 (1984-05-01), Cohen
patent: 4479698 (1984-10-01), Landis et al.
patent: 4500165 (1985-02-01), Scholl et al.
patent: 4523802 (1985-06-01), Sakaguchi et al.
patent: 4548466 (1985-10-01), Evans et al.
patent: 4615097 (1986-10-01), Geneguand
patent: 4752109 (1988-06-01), Gordon et al.
patent: 4773727 (1988-09-01), Le Pivert et al.
patent: 4778241 (1988-10-01), Haltenorth
patent: 4803329 (1989-02-01), Nakata et al.
patent: 4831228 (1989-05-01), Schumacher
patent: 4837768 (1989-06-01), Schmid
patent: 4874217 (1989-10-01), Janssen
patent: 4887882 (1989-12-01), Mousseaux et al.
patent: 5066093 (1991-11-01), Greil et al.
patent: 5177807 (1993-01-01), Avelange et al.
patent: 5187876 (1993-02-01), Hatheway
patent: 5210811 (1993-05-01), Avelange et al.
patent: 5300755 (1994-04-01), Nishitani et al.
patent: 5301251 (1994-04-01), Moore et al.
patent: 5360958 (1994-11-01), Bogue et al.
patent: 5367140 (1994-11-01), Jouaneh et al.
patent: 5570444 (1996-10-01), Janssen et al.
patent: 5619609 (1997-04-01), Pan et al.
patent: 5631989 (1997-05-01), Koren et al.
patent: 5727099 (1998-03-01), Harman
patent: 5793915 (1998-08-01), Joyce
patent: 5833202 (1998-11-01), Wolfgang
patent: 5854869 (1998-12-01), Joyce
patent: 5930430 (1999-07-01), Pan et al.
patent: 5963695 (1999-10-01), Joyce
patent: 5977567 (1999-11-01), Verdiell
patent: 6056447 (2000-05-01), Caras
patent: 6106161 (2000-08-01), Basavanhally et al.
patent: 6174092 (2001-01-01), Siala
patent: 6184987 (2001-02-01), Jang et al.
patent: 6190056 (2001-02-01), Kwon et al.
patent: 6207950 (2001-03-01), Verdiell
patent: 6227724 (2001-05-01), Verdiell
patent: 6247852 (2001-06-01), Joyce
patent: 6252726 (2001-06-01), Verdiell
patent: 6266470 (2001-07-01), Kang et al.
patent: 6490303 (2002-12-01), Komiyama et al.
patent: 6511236 (2003-01-01), Webjorn et al.
patent: 6663294 (2003-12-01), Crane, Jr. et al.
patent: 2003/0196992 (2003-10-01), Demers et al.
patent: 0 662 622 (1995-07-01), None
patent: 1 115 016 (2001-07-01), None
patent: WO 85/02802 (1985-07-01), None
patent: WO 91/06022 (1991-05-01), None
patent: WO 99/15928 (1999-04-01), None
patent: WO 99/35694 (1999-07-01), None
patent: WO 00/42464 (2000-07-01), None
patent: WO 00/42629 (2000-07-01), None
patent: WO 01/16634 (2001-03-01), None
patent: WO 01/18580 (2001-03-01), None
patent: WO 01/37023 (2001-05-01), None
Smith, Flexures—Elements of Elastic Mechanisms, 2000, ISBN 90-5699-261-9, Gordon and Breach Science Publishers, Chapter 7, p. 335-372.
Smith et al, Foundations of Ultraprecision Mechanism Design, 1992, Gordon and Breach Science Publishers, Chapter 4, p. 95-129.
Anderson, Design and Manufacturability Issues of a Co-packaged DFB/MZ Module, Sep. 1999, IEEE 1999 Electronic Components and Technology Conference, p. 197.
Ming C. Wu, Micromachining for Optical and Optoelectronic Systems, Nov. 1997,Proceedings of the IEEE, vol. 85, No. 11, pp. 1833-1856.

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