Sub-ground plane for micromachined device

Details Sub-ground plane for micromachined device Sub-ground plane for micromachined device

1995-06-07

1997-06-17

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428209, 437228, 333186, 7351432, B32B 300, H03H 900, G01P 1500

Patent

active

056395426

ABSTRACT:
A method and apparatus for providing a sub-ground plane for a micromachined device. The sub-ground plane is formed in or on the substrate. Above the sub-ground plane is a dielectric and then a discontinuous conductive layer used for interconnects for parts of the micromachined device. A movable microstructure is suspended above the interconnect layer. A conductive layer can be suspended above the movable microstructure. In one embodiment, the sub-ground plane is diffused into the substrate or a well in the substrate, and is of an opposite type from the type of silicon into which it is diffused. Alternatively, the sub-ground plane is formed from a conductive layer, deposited over the substrate before the layer used for interconnects.

REFERENCES:
patent: 5326726 (1994-07-01), Tsang
patent: 5345824 (1994-09-01), Sherman
patent: 5479703 (1996-01-01), Desai
patent: 5537083 (1996-07-01), Lin

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