Sub-assembly

Details Sub-assembly Sub-assembly

2007-03-06

2008-11-11

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S717000, C165S185000, C257S712000, C257S719000

Reexamination Certificate

active

07450389

ABSTRACT:
A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element (18, 19) which is permanently connected to the power semiconductor module. When mounted, the pressure element (18) presses the heat-dissipation contact surface (16) against the cooling element (17).

REFERENCES:
patent: 4009485 (1977-02-01), Koenig
patent: 5386338 (1995-01-01), Jordan et al.
patent: 5428897 (1995-07-01), Jordan et al.
patent: 6542365 (2003-04-01), Inoue
patent: 6759278 (2004-07-01), Ashdown
patent: 6812562 (2004-11-01), Ashdown
patent: 7034395 (2006-04-01), Stolze
patent: 7106592 (2006-09-01), Inoue et al.
patent: 2002/0109220 (2002-08-01), Ashdown
patent: 3505085 (1986-08-01), None
patent: 44 45 541 (1995-06-01), None
patent: 297 20 480 (1999-04-01), None
patent: 200 14 739 (2001-01-01), None
patent: 199 42 915 (2001-03-01), None
patent: 101 42 971 (2003-03-01), None
patent: 101 49 886 (2003-04-01), None
patent: 0 295 387 (1988-12-01), None
patent: 0 434 298 (1991-06-01), None
patent: 63226048 (1988-09-01), None
patent: 93/16580 (1993-08-01), None
German Office Action for German Patent Application No. 10 2004 043 019.5 (3 pages), Mar. 20, 2005.
International Search Report and Written Opinion for International Application No. PCT/EP2005/007514 (12 pages), Nov. 28, 2005.
International Preliminary Report on Patentability for International Application No. PCT/EP2005/007514 (7 pages), Mar. 29, 2007.
Eschrich, Fred; “IGBT Modules Simplify Inverter Design,” Jul./Aug. 1996, pp. 284-286.

Affiliated with

Also associated with

Rating

Sub-assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sub-assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sub-assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4049582