Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
1999-04-14
2002-02-19
Mulcahy, Peter D. (Department: 1713)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C524S449000, C524S494000, C524S493000
Reexamination Certificate
active
06348540
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a styrenic resin composition and a semiconductor carrier device. More precisely, it relates to a styrenic resin composition comprising, as the essential component, a styrenic polymer which consists chiefly of a syndiotactic structure (hereinafter referred to as “syndiotactic polystyrene” or SPS) and containing a fibrous filler and a tabular filler of which the physical morphology is specifically defined, and also to semiconductor carrier devices as produced by molding the styrenic resin composition.
2. Description of the Related Art
Syndiotactic polystyrenes (SPS) have the advantages of good heat resistance, good electrical characteristics, good chemical resistance, etc., and are widely used as engineering plastics for precision components. In order to further expand their applications, it is desired to much more improve the impact resistance of SPS and to prevent the moldings of SPS from being warped.
Regarding the technique of improving the impact resistance of SPS, a styrenic resin composition has been proposed, which comprises SPS and contains a surface-modified inorganic filler and other additives (JP-A 03-126743).
The improvement in the impact resistance of the composition could be rather well, but the reduction in the warpage of the moldings of the composition is not satisfactory for severer requirements. Given that situation, it is desired to develop materials that satisfy both high impact resistance and low warpage.
The present invention has been made from the viewpoint noted above, and its object is to provide a syndiotactic polystyrenic resin composition of which the moldings have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins, and to provide semiconductor carrier devices as produced by molding the styrenic resin composition.
SUMMARY OF THE INVENTION
We, the present inventors have assiduously studied, and, as a result, have found that the object can be attained by adding a predetermined amount of a fibrous filler and a predetermined amount of a tabular filler of which the physical morphology is specifically defined, to a styrenic resin composition that comprises, as the essential component, a syndiotactic polystyrene (SPS). The invention is completed on the basis of this finding.
Specifically, the invention provides a styrenic resin composition to be mentioned below, and semiconductor carrier devices as produced byt molding the stryrenic resin composition.
1. A stryrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing a styrenic polymer that consists chiefly of a syndiotactic structure;
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler and;
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
2. A styrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing from 50 to 99% by weight of (A) a styrenic polymer that consists chiefly of a syndiotactic structure and from 1 to 50% by weight of (B) a rubber-like elastomer having affinity for the component (A);
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler and;
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
3. A styrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing from 50 to 95% by weight of (A) a styrenic polymer that consists chiefly of a syndiotactic structure, from 1 to 49.9% by weight of (B) a rubber-like elastomer having affinity for the component (A), and from 0.1 to 10% by weight of (E) a polymer having compatibility with or affinity for the component (A) and having a polar group;
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler; and
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
4. A styrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing from 5 to 94% by weight of (A) a styrenic polymer that consists chiefly of a syndiotactic structure, from 1 to 50% by weight of (B) a rubber-like elastomer having affinity for the component (A), and from 5 to 94% by weight of (F) a thermoplastic resin except (A);
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler; and
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
5. A styrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing from 5 to 93.9% by weight of (A) a styrenic polymer that consists chiefly of a syndiotactic structure, from 1 to 50% by weight of (B) a rubber-like elastomer having affinity for the component (A), from 0.1 to 10% by weight of (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, and from 5 to 93.9% by weight of (F) a thermoplastic resin except (A);
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler; and
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
6. A styrenic resin composition comprising,
a) 100 parts by weight of a styrenic resin composition containing from 50 to 99% by weight of (A) a styrenic polymer that consists chiefly of a syndiotactic structure and from 1 to 50% by weight of (G) a polyolefin having a melt index (MI), as measured at 190° C. and under a load of 2.16 kg, of at most 25 (g/10 min);
b) from 10 to 350 parts by weight, relative to 100 parts by weight of the composition, of (C) a fibrous filler; and
c) from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120.
7. The styrenic resin composition of any one of (1) to (6), wherein the fibrous filler (C) is glass fibers, and the tabular filler (D) having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120 is any of mica or glass flakes.
8. Semiconductor carrier devices as produced by molding the styrenic resin composition of any one of (1) to (7) and having a surface resistance of from 10
2
to 10
12
&OHgr;.
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the invention are described in detail hereinunder.
1. Components Constituting the Styrenic Resin Composition of the Invention
The styrenic resin composition of the invention comprises a resin moiety and an inorganic filler moiety to be mentioned below. The resin moiety comprises, as the indispensable component, the component (A) to be mentioned below, and optionally contains the component (B), the component (E), the component (F) and the component (G) also to be mentioned below. The inorganic filler moiety comprises the component (C) and the component (D) to be mentioned below.
I. Resin Moiety
(A) Styrenic Polymer Consisting Chiefly of a Syndiotactic Structure
In the component (A), styrenic polymer that consists chiefly of a syndiotactic structure, the syndiotactic structure indicates the stereochemical structure of the polymer in which the side chains of phenyl groups are alternately positioned in the opposite sides relative to the main chain composed of carbon-carbon bonds, and its tacticity is determined according to the nuclear magnetic resonance of the polymer with an isotopic carbon (
13
C-NMR). The tacticity to be determined accord
Mihara Masami
Miura Shin'ichi
Nakamichi Masahiro
Sugioka Taizou
Yamao Shinobu
Idemitsu Petrochemical Co. Ltd.
Mulcahy Peter D.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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