Styrenic resin composition and polystyrene oriented film

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428521, 525227, B32B 516

Patent

active

057981728

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a styrenic resin composition and a polystyrene oriented film. More particularly, it pertains to a styrenic resin composition useful for the material for an oriented film and to a polystyrene oriented film useful as various base materials such as base materials for capacitor films, self-adhesive tape films, electrically insulating films and package films.


BACKGROUND ART

A styrenic polymer having a syndiotactic configuration (hereinafter sometimes abbreviated to "SPS") is excellent in mechanical strength, heat resistance, external appearance, solvent resistance and the like and accordingly, is expected to find a variety of use. In particular, there are proposed extrusion technique for various films, sheets and fibers, molded products and purpose of use.
In general, the physical properties of an extrusion molded product vary widely depending on the material and molding process and molding conditions depend upon the characteristics of the material to be used and therefore, it is extremely important to develop the materials for molded products in order to develop excellent molded products.
Since film slipperiness is one of the most important characteristics in the development of an extremely thin film, there are proposed methods in which various inorganic particles are added, as anti-blocking agent, to a SPS film for the purpose of improving the slipperiness of the SPS. Such SPS films are disclosed in Japanese Patent Application Laid-Open Nos. 182346/1989, 74437/1991, 57013/1994, 57014/1994, 57015/1994, 57016/1994, 57017/1994, 64036/1994, 64037/1994, 65399/1994, 65400/1994, 65401/1994, 65402/1994, 80793/1994, 91748/1994, 91749/1994, 114924/1994 and 114925/1994.
Moreover in order to improve the dynamical physical properties of the SPS, a composition comprising the SPS and a rubber component is proposed and disclosed in Japanese Patent Application Laid-Open Nos. 146944/1989, 182344/1989, 182346/1989, 182350/1989 and 292049/1989.
However, when conventional inorganic grains are optionally added to the SPS, there have been caused the problem that the melt heat stability of the SPS is lowered and the problem that white powders are generated at the time of continuous produciton of SPS films. In addition, it has been difficult to produce a film excellent in both slipperiness and dielectric breakdown characteristics for AC.
Further, it has been a problem that when conventional inorganic grains are optionally added to the SPS, there is observed damage to the SPS film due to the falling off of the inorganic grains as the lubricant or the deterioration of the dynamical characteristics of the film, In addition, sufficient investigation has never been made on the slipperiness of the SPS film produced from the composition containing the SPS and a rubber component.


DISCLOSURE OF THE INVENTION

Under such circumstances intensive research and investigation have been made by the present inventors in order to solve the above-mentioned problems and thereby enable the production of a film excellent in slipperiness and tear strength as well as in moldability. As a result, it has been found that the deterioration of the film due to melt heat can been suppressed by the use of inorganic grains having a specific pH value a lubricant, also that the generation of white powders at the time of continuous production of films can be decreased by using inorganic grains having a specific chemical composition and further that a thin film having favorable slipperiness can be produced by adding a specific amount of inorganic grains having a specific grain size, a specific grain size distribution and a specific shape, while dynamical physical properties and electrical characteristics of the film are preserved.
On the basis of the above-mentioned finding and information, it has further been found that a resin composition which comprises specific materials and has a specific compositional ratio is excellent in melt heat stability, is minimized in the generation of white powders at the time of conr

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