Studded heat exchanger for integrated circuit package

Details Studded heat exchanger for integrated circuit package Studded heat exchanger for integrated circuit package

1976-11-03

1978-01-17

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 174 16HS, 165 80, H01L 2302, H01L 3902

Patent

active

040694984

ABSTRACT:
Heat is removed from the silicon devices in an integrated circuit package by means of a stud which is slidably mounted in a cap enclosing the integrated circuit device. A low melt solder is used to join the stud to the cap and the same solder is also deposited on the stud tip, which will subsequently contact the integrated circuit device in the package. After the integrated circuit, substrate and cap are assembled and sealed, the assembly is heated to melt the low melt solder so that the stud slides down and makes contact with the integrated circuit device. A controlled pressure can be applied to the stud if sliding does not occur. Thereafter, the assembly is allowed to cool. Upon cooling, a submicron gap exists between the solder on the tip of the stud and the device providing electrical isolation, but not significantly degrading the thermal path between the device and the ambient atmosphere.

REFERENCES:
patent: 2776920 (1957-01-01), Dunlap
patent: 3896544 (1975-07-01), Fosnough
Microcircuit Heat Sink; by Suden; IBM Technical Disclosure Bulletin, vol. 8, No. 10, Mar. 1966, p. 1457.
High-Power Multi-Chip Packaging by Lee, IBM Technical Disclosure Bulletin, vol. 13, No. 12, May 1971, p. 3721.
Chip Cooling, by Campo., IBM Technical Disclosure Bulletin, vol. 17, No. 2, July 1974, p. 392.
Semiconductor Module with Improved Air Cooling; by Cain, IBM Technical Bulletin, vol. 19, No. 5, Oct. 1976, p. 1802.

Affiliated with

Also associated with

Rating

Studded heat exchanger for integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Studded heat exchanger for integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Studded heat exchanger for integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2284389