Stud-type semiconductor device

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Details

357 74, 357 81, 357 68, H01L 2342, H01L 2344, H01L 2346

Patent

active

041433955

ABSTRACT:
A semiconductor device includes a semiconductor element having at least three semiconductor areas corresponding to first, second and third semiconductor areas, a first electrode connecting means comprising a cylindrical stud electrically connected to the first semiconductor area of the semiconductor element, and second and third electrode connecting means connected to the closed end of a housing in a position deviated from the axis of the cylindrical stud. The second electrode connecting means has a cylindrical section situated concentric with the cylindrical stud and including a free end, and includes a through hole extending from a side surface thereof toward the free end while passing through the center of the cylindrical section. The third electrode connecting means comprising a flexible lead and it is received in the through hole of the second electrode connecting means. The second electrode connecting means is electrically connected to the second semiconductor area of the semiconductor element through a lead and the third electrode connecting means is electrically connected to the third semiconductor area of the semiconductor element through a lead.

REFERENCES:
patent: 2922935 (1960-01-01), Dolder
patent: 3160800 (1964-12-01), Smart
patent: 3242390 (1966-03-01), Scharli
patent: 3294895 (1966-12-01), Reintgen
patent: 3337781 (1967-08-01), Ferree
patent: 3433885 (1969-03-01), Choffart

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