Stud bumping apparatus

Details Stud bumping apparatus Stud bumping apparatus

2007-12-04

2007-12-04

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C228S004500, C228S042000, C228S047100

Reexamination Certificate

active

10612383

ABSTRACT:
The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

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patent: 3429375 (1985-12-01), None
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