Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-10-10
2006-10-10
Duverne, J. F. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07118389
ABSTRACT:
A socket for solderless connection between a stud-bumped IC chip and a host PCB. The socket includes a three-dimensional (e.g., cylindrical or cubical) hollow metal frame that is either free-standing or supported by an underlying patterned template structure. The metal frame includes side walls that extend away from the host PCB, and a contact structure located at the upper (i.e., free) end of the side walls. The contact structure defines an opening through which a stud bump can be inserted into a central chamber of the metal frame. The side walls and/or the contact structure are formed such that when the tip end of the stud bump is inserted into the central chamber, at least one of the base structure and the sidewall of the stud bump abuts the contact structure at two or more contact points.
REFERENCES:
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5812378 (1998-09-01), Fjelstad et al.
patent: 6374487 (2002-04-01), Haba et al.
patent: 6555764 (2003-04-01), Maruyama et al.
patent: 6837721 (2005-01-01), Soeta
Jordan: “Gold Stud Bump In Flip-Chip Applications”, Palomar Technologies, Inc., 2002, 4 pgs.
Yoon et al.: “RF Mems Based On Epoxy-Core Conductors”, Solid-State Sensor, Actuator and Microsystems Workshop Hilton Head Island, South Carolina, Jun. 2-6, 2002, pp. 374-375.
Guerin: “3-D Multichip Modules And Microclip; A Simple And Low-Cost Vertical Interconnection Technique”, SOTEC Microsystems, Jul. 14, 1997, 1 pg.
Daniel Jurgen
Fork David K.
Bever Patrick T.
Bever Hoffman & Harms LLP
Duverne J. F.
Palo Alto Research Center Incorporated
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