Structuring and circuitizing printed circuit board...

Details Structuring and circuitizing printed circuit board... Structuring and circuitizing printed circuit board...

2011-05-03

2011-05-03

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000, C029S852000

Reexamination Certificate

active

07935895

ABSTRACT:
Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.

REFERENCES:
patent: 5310986 (1994-05-01), Zumoto et al.
patent: 6388208 (2002-05-01), Kiani et al.

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