Structures for Z-aligned proximity communication

Details Structures for Z-aligned proximity communication Structures for Z-aligned proximity communication

2005-10-12

2010-02-09

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257S736000, C257SE23078

Reexamination Certificate

active

07659619

ABSTRACT:
A device includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to the first surface. The first semiconductor die is configured to have a flexibility compliance greater than a first pre-determined value in a direction substantially perpendicular to a plane including the plurality of proximity connectors in order to reduce misalignment in the direction between the plurality of proximity connectors and additional proximity connectors on another device.

REFERENCES:
patent: 5917707 (1999-06-01), Khandros et al.
patent: 6181287 (2001-01-01), Beigel
patent: 6998703 (2006-02-01), Di Stefano
patent: 2001/0002624 (2001-06-01), Khandros et al.
patent: 2004/0238851 (2004-12-01), Flores et al.
patent: 2005/0205985 (2005-09-01), Smith et al.

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