Structures for implementing integrated conductor and...

Details Structures for implementing integrated conductor and... Structures for implementing integrated conductor and...

2005-06-14

2005-06-14

Thomas, Eric (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S303000, C361S306100, C361S311000

Reexamination Certificate

active

06906910

ABSTRACT:
Structures are provided for implementing an integrated conductor and capacitor in a surface mounted device (SMD) package. A first pair and a second pair of contacts contained within the SMD package respectively are provided in mating engagement with a first pair and a second pair of corresponding SMD package contacts. A conductor extends between the first pair of contacts, contained within the SMD package. A capacitor is defined between the second pair of contacts, contained within the SMD package. An additional one or pair of integral capacitors optionally is provided for providing additional capacitance to ground to decouple common mode noise from the power planes.

REFERENCES:
patent: 5590016 (1996-12-01), Fujishiro et al.
patent: 6475607 (2002-11-01), Ueda et al.
patent: 2003/0151471 (2003-08-01), Yamada et al.

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