Structures for electrically conductive decals filled with organi

Details Structures for electrically conductive decals filled with organi Structures for electrically conductive decals filled with organi

1992-12-23

1994-04-26

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174264, H05K 100

Patent

active

053068726

ABSTRACT:
The present invention relates generally to new decal structures, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

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G. Kraus, et al., "Process for Transferring Thin-Film Conductor Patterns to a Multilayer Ceramic Substrate for Semiconductor Chips," IBM Technical Disclosure Bulletin, vol. 27, No. 3, pp. 1404-1405 (Aug. 1984).
G. R. Simonds, et al., "The Encyclopedia of Basic Materials for Plastics." New York, Reinhold Pub. Co., pp. 4 & 156.

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