Structures for electrically conductive decals filled with inorga

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174261, 174262, 174264, 361784, H05K 100

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active

053389000

ABSTRACT:
The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

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McGraw-Hill Dictionary of Scientific Technical Terms Second Edition, McGraw-Hill Book Company, 1978, p. 135.
G. Kraus, et al., "Process for Transferring Thin-Film Conductor Patterns to a Multilayer Ceramic Substrate for Semiconductor Chips," IBM Technical Disclosure Bulletin, vol. 27, No. 3 pp. 1404-1405 (Aug., 1984).

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