Structures and processes for fabricating moisture resistant chip

Details Structures and processes for fabricating moisture resistant chip Structures and processes for fabricating moisture resistant chip

1999-11-23

2000-11-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361705, 361708, 361717, 361718, 361760, 361761, 361764, 361765, 361783, 257700, 257706, 257707, 257774, 257787, 257796, H05K 720

Patent

active

061543667

ABSTRACT:
A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active surface includes at least one contact. A flex component is attached by a first surface to the microelectronic die active surface. At least one conductive trace is disposed on a second surface of the flex component and extends through the flex component to contact at least one of the contacts. An encapsulation material is adjacent the microelectronic die side and a bottom surface of the flex component. A moisture barrier is disposed on the flex component and the conductive trace(s). A second moisture barrier may be disposed on the encapsulation material. A heat dissipation device may also be incorporated into the chip-on-flex package.

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