Stock material or miscellaneous articles – Magnetic recording component or stock – Thin film media
Reexamination Certificate
2011-08-23
2011-08-23
Rickman, Holly (Department: 1785)
Stock material or miscellaneous articles
Magnetic recording component or stock
Thin film media
Reexamination Certificate
active
08003238
ABSTRACT:
The invention provides a structured material composed by including a noble metal, in which an oriented layer is formed on a layer containing a Group 4A metal. The invention enables to form an oriented layer, which has required a high temperature for formation, by a low temperature process.
REFERENCES:
patent: 6248416 (2001-06-01), Lambeth et al.
patent: 6562453 (2003-05-01), Futamoto et al.
patent: 6916557 (2005-07-01), Hirayama et al.
patent: 7108926 (2006-09-01), Lee
patent: 2002/0048696 (2002-04-01), Kukino et al.
patent: 2002/0086186 (2002-07-01), Lee
patent: 1186580 (2002-03-01), None
patent: 2001/23140 (2007-01-01), None
patent: 99/24973 (1999-05-01), None
Sato, et al., “Co-Cr-Ta Perpendicular . . . Using Pt Seed Layer”, IEEE Trans. On Magnetics, vol. 36, No. 5, pp. 2387-2389 (Sep. 2000).
Ariake et al., “Pt and Pd Intermediate Layers . . . magnetic recording media”, J. of Magnetism and Magnetic Materials, 242-245 (2002) 311-316.
Iijima, et al., “Preparation of c-axis oriented PbTiO3thin films and their crystallographic, dielectric, and pyroelectric properties”; J. Appl. Phys. vol. 60, No. 1, pp. 361-367 (1986).
Den Tohru
Yasui Nobuhiro
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Rickman Holly
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