Structured copper strain buffer

Details Structured copper strain buffer Structured copper strain buffer

1978-09-21

1983-05-24

James, Andrew J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 65, 357 67, 357 79, 357 81, 228193, 228243, H01L 2348, H01L 2946, H01L 2962

Patent

active

043853102

ABSTRACT:
A structured copper strain buffer, which is thermally and electrically conductive is provided for use with semiconductor electronic devices. A thermo-compression diffusion bond is used to attach a metallic foil to a structured copper disk to form the strain buffer. The individual strands of copper within the strain buffer are capable of independent movement. The structured copper strain buffer provides a means of attachment to a semiconductor device without causing a stress to be generated at the attached surface of the device as the device expands and contracts with temperature changes.

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Bell Laboratories Record; Electrical Contact with Thermo-Compression Bonds; by Christensen, Apr. 1958, pp. 127-130.

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