Structure with through hole, production method thereof, and...

Details Structure with through hole, production method thereof, and... Structure with through hole, production method thereof, and...

2006-03-28

2006-03-28

Nelms, David (Department: 2818)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C257S276000

Reexamination Certificate

active

07018020

ABSTRACT:
A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.

REFERENCES:
patent: 5517224 (1996-05-01), Kaizu et al.
patent: 5658471 (1997-08-01), Murthy et al.
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6382775 (2002-05-01), Kubota et al.
patent: 6450621 (2002-09-01), Hayakawa
patent: 6467884 (2002-10-01), Murooka et al.
patent: 6534247 (2003-03-01), Milligan et al.
patent: 6685304 (2004-02-01), Miyamoto
patent: 10-181032 (1998-07-01), None

Affiliated with

Also associated with

Rating

Structure with through hole, production method thereof, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure with through hole, production method thereof, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure with through hole, production method thereof, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3610716