Structure with heat dissipating device and method

Details Structure with heat dissipating device and method Structure with heat dissipating device and method

2007-04-24

2007-04-24

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

C427S249100

Reexamination Certificate

active

10127585

ABSTRACT:
A structure comprises a thermal energy generating component and a thermal dissipating device in thermal conductive contact with the component, the device comprising a substrate with a fullerene coating. A method of producing a computer comprises applying a layer of fullerene onto a substrate and disposing the substrate in a heat dissipation relationship to a microprocessor.

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