Structure to effect adhesion between substrate and ink barrier i

Details Structure to effect adhesion between substrate and ink barrier i Structure to effect adhesion between substrate and ink barrier i

1997-03-04

2000-12-05

Barlow, John

Incremental printing of symbolic information

Ink jet

Ejector mechanism

B41J 205

Patent

active

061556742

ABSTRACT:
A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer of a thin film substrate and a polymer ink barrier layer in the vicinity of ink chambers formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide layer disposed on the ink barrier layer and an orifice plate. An intervening adhesion promoter can be located between the silicon carbide layer of the thin film substrate and the polymer ink barrier layer, and between the silicon carbide layer disposed on the ink barrier layer and the orifice plate.

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patent: 5635968 (1997-06-01), Bhaskar et al.
"Development Of The Thin-Film Structure For The ThinkJet Printhead," Bhaskar & Aden, Hewlett-Packard Journal, vol. 36, No. 5, May 1985, pp. 27-33.
"Development Of A High-Resolution Thermal Inkjet Printhead," Buskirk, Hackleman, Hall, Kanarek, Low, Trueba, Van de Poll, Hewlett-Packard Journal, vol. 39, No. 5, Oct. 1988, pp. 55-61.
"The Third-Generation HP Thermal InkJet Printhead," Aden, Bohorquez, Collins, Crook, Garcia & Hess, Hewlett-Packard Journal, vol. 45, No. 1, Feb. 1994, pp. 41-45.
"Developement of the Thin-film Structure For the ThinkJet Printhead," Bhaskar & Aden, Hewlett-Packard Journal, vol. 36, No. 5, May 1985, pp. 27-33, May 1995.
Copy of EPO Search Report, dated Jun. 15, 1998, from application EP 97 12 0951.
Copy of EPO Search Report, dated Jun. 15, 1998, from application EP 97 12 0952.

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