Structure of stacked vias in multiple layer electrode device...

Details Structure of stacked vias in multiple layer electrode device... Structure of stacked vias in multiple layer electrode device...

2008-01-15

2008-01-15

Dinh, Tuan T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000, C361S803000

Reexamination Certificate

active

07319197

ABSTRACT:
A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a,205b,205c) belonging to three adjacent conductive layers (110a,110b,110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.

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