Structure of solid state image pickup device

Television – Camera – system and detail – With single image scanning device supplying plural color...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C348S275000

Reexamination Certificate

active

06690421

ABSTRACT:

This application is based on Japanese patent applications No. 8-288857 filed on Oct. 30, 1996, and No. 8-288858 filed on Oct. 30, 1996, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
a) Field of the Invention
The present invention relates to a solid state image pickup device, and more particularly to the structure of a solid state image pickup device suitable for realizing high resolution and capable of reading pixel signals of one frame at the same time.
b) Description of the Related Art
Charge transfer type solid state image pickup devices or so-called charge coupled devices (CCD) have been developed to mount them on cameras of televisions, video tape recorders and the like of NTSC standards. In NTSC standards, an image of one frame is divided into signals of two fields through interlace scanning, and signal charges of photosensors of the first or second field are read at the same time. In other words, two photosensors are generally provided with one transfer stage.
Non-interlace scanning is necessary, however, for electronic still cameras or televisions of new standards. In this case, one photosensor is provided with one transfer stage (generally four electrodes). As a method of configuring this structure, a solid state image pickup device having the structure shown in
FIG. 9
has been proposed.
FIG. 10
is a schematic plan view showing at a larger scale a partial area of a solid image pickup device of the non-interlace type that signals of all pixels of one frame can be read at the same time. In
FIG. 10
, reference numeral
1
represents a photoelectric conversion element (hereinafter called a photosensor) such as a photodiode. Photosensors
1
generally indicated at
2
a
and disposed in the vertical direction (column direction) as viewed in
FIG. 10
constitute a first photosensor column. Photosensors
1
generally indicated at
2
b
and disposed in the vertical or column direction constitute a second photosensor column. The first and second photosensor columns
2
a
and
2
b
are alternately juxtaposed in the right/left direction (row direction) as viewed in FIG.
10
. Photosensors
1
generally indicated at
3
and disposed in the row direction constitute a first photosensor row. Photosensors
1
generally indicated at
4
and disposed in the row direction constitute a second photosensor row. The first and second photosensor rows
3
and
4
are alternately disposed side by side in the column direction.
In
FIG. 10
, reference numerals
5
and
6
represent first and second column direction charge transfer devices for reading signal charges of the first and second photosensor columns
2
a
and
2
b
and transferring the read charges in the column direction. In other words, the first and second column direction charge transfer devices are disposed on both sides of each photosensor column to receive signal charges from every second photosensors and transfer them in the column direction.
Also in
FIG. 10
, reference numeral
7
represents a controller (gate) for controlling to select signal charges transferred by either the first or second column direction charge transfer device
5
,
6
and transfer the selected signal charges to a row direction charge transfer device
8
which transfers the received signal charges in the row direction. Reference numeral
9
represents an output circuit (amplifier) for generating voltages corresponding to the amounts of signal charges transferred from the row direction charge transfer device
8
and outputting the generated voltages to an external circuit (not shown). The photosensors
1
, column direction charge transfer devices
5
and
6
, controllers
7
, row direction charge transfer device
8
and output circuit
9
are all integrally formed on a single semiconductor substrate (not shown).
In the above-described solid state image pickup device shown in
FIG. 10
, the first and second column direction charge transfer devices
5
and
6
are disposed on both sides of each photosensor column
2
a
,
2
b
and provide one transfer stage
150
per one photosensor
1
. Each transfer stage
150
includes charge signal storage regions (packets).
Solid state image pickup devices used with electronic still cameras or television cameras of new standards are desired to have the same pitch of photosensors both in the row and column directions. If the pitch of photosensors is same in both the row and column directions, photosensors can be disposed in a square lattice shape. This layout is advantageous in that the pitch of pixels of a display device has integrity with that of photosensors of the solid state image pickup device and in that signal processing becomes easy.
However, since two column direction charge transfer devices
5
and
6
are disposed between the first and second photosensor columns
2
a
and
2
b
, the pitch Wh of photosensors disposed in the row direction is longer than that Wv of photosensors disposed in the column direction, and it is difficult to shorten the pitch in the row direction. In order to make both the pitches equal, the pitch in the column direction is required to be broadened to the pitch in the row direction. This approach, however, results in difficulty in high integration of solid state image pickup devices.
Further, in the structure shown in
FIG. 10
, the direction of reading signal charges of photosensors in each row by the first column charge transfer device
5
is opposite to that by the second column charge transfer device
6
. If the relative position of the photosensor columns
2
a
and
2
b
and the first and second column direction charge transfer devices
5
and
6
is displaced during the manufacture processes of solid state image pickup devices, the characteristics of reading pixel signals change between adjacent photosensors disposed in the row direction. For example, if the photosensors
1
are displaced to the right relative to the column direction charge transfer devices
5
and
6
, the relative position of the photosensors
1
constituting the first photosensor row
3
and the first column transfer device
5
becomes short whereas the relative position of the photosensors
1
constituting the second photosensor row
4
and the second column transfer device
6
becomes long. Therefore, signal charges of the first photosensor row
3
are easy to read, whereas signal charges of the second photosensor row
4
are difficult to read.
Still further, since the amounts of false signals called smear become different between the first and second column direction charge transfer devices
5
and
6
, a fatal fixed pattern in a vertical strip shape appears as noises. Smear is generated by the leakage of a fraction of light incident upon the photosensor
1
to the column direction charge transfer devices
5
and
6
.
In the structure of such a conventional solid state image pickup device, the pitch in the row direction from the first column direction charge transfer device
5
to the second transfer device
6
interposing an element separation layer
10
therebetween is different from the pitch from the second transfer device
6
to the first transfer device
5
interposing each photosensor
1
therebetween. For the coupling of charge signals between the first and second column direction charge transfer devices
5
and
6
to the row direction charge transfer device
8
, it becomes necessary to make the pitch of all the first and second column direction charge transfer devices
5
and
6
equal to that of all transfer stages of the row direction charger transfer device
8
. To this end, the controller
7
is provided between the column direction charge transfer device
5
,
6
and the row direction charge transfer device
8
, so as to substantially combine two adjacent first and second column direction charge transfer devices
5
and
6
and couple a combined set of two transfer devices
5
and
6
to the row direction charge transfer device
8
. However, in this case, in transferring all signal charges of one row in the column direction, two complicated t

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Structure of solid state image pickup device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure of solid state image pickup device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure of solid state image pickup device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3341022

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.