Structure of semiconductor laser package

Details Structure of semiconductor laser package Structure of semiconductor laser package

1992-02-20

1993-08-03

Scott, Jr., Leon

Coherent light generators

Particular temperature control

372 38, 372 29, H01S 304

Patent

active

052336220

ABSTRACT:
A semiconductor laser package comprises a cooling structure constituted by sequentially laminating a lower substrate, a Peltier element, and an upper substrate, a heat sink having a laser element and mounted on the cooling structure, and a cap member for sealing the cooling structure and the heat sink, wherein one of the upper and lower substrate also serves as a base member of the semiconductor laser package.

REFERENCES:
patent: 4604753 (1986-08-01), Sawai
patent: 4803689 (1989-02-01), Shibanuma

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