Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-10-17
2006-10-17
Friedman, Carl D. (Department: 3635)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S085000, C156S259000
Reexamination Certificate
active
07122091
ABSTRACT:
A structure of retaining cut-processed components includes a first base (18A). The structure includes cut-processed components (1A) removably fixed to the first base, with the cut-components aligned with each other in a longitudinal direction of the first base. The cut-processed components have first and second cut surfaces (1Aa,1Ab) parallel to each other. First cut surfaces are positioned flush with each other. Second cut surfaces are positioned flush with each other. The cut-processed components are fixed to the first base by a dissoluble adhesive (20).
REFERENCES:
patent: 3084403 (1963-04-01), Elmendorf
patent: 4166001 (1979-08-01), Dunning et al.
patent: 4199645 (1980-04-01), Schwarz
patent: 4356676 (1982-11-01), Hauptman
patent: 5704105 (1998-01-01), Venkataramani et al.
patent: 5758396 (1998-06-01), Jeon et al.
patent: 5976691 (1999-11-01), Noguchi et al.
patent: 5980675 (1999-11-01), Tsuchihashi et al.
patent: 5985067 (1999-11-01), Schmid et al.
patent: 6176966 (2001-01-01), Tsujimoto et al.
patent: 6210514 (2001-04-01), Cheung et al.
patent: 6374761 (2002-04-01), Dhellemmes
patent: 6484789 (2002-11-01), Ober
patent: 6603240 (2003-08-01), Kohno et al.
patent: 6702910 (2004-03-01), Noguchi et al.
patent: 50-056066 (1975-05-01), None
patent: 53-112590 (1978-10-01), None
patent: 59-213486 (1984-12-01), None
patent: 63-055986 (1988-03-01), None
patent: 01-244682 (1989-09-01), None
patent: 02-098179 (1990-04-01), None
patent: 2000-074739 (2000-03-01), None
patent: 2001-284163 (2001-10-01), None
patent: 2001-320103 (2001-11-01), None
patent: 2002-050807 (2002-02-01), None
patent: 2002-299713 (2002-10-01), None
patent: 05-169425 (2003-07-01), None
Kitamura Kazumasa
Tsuji Hiroyuki
Burr & Brown
Friedman Carl D.
Katcheves Basil
NGK Insulators Ltd.
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