Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-12
1999-10-19
Bradley, Paula
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439108, H01R 909
Patent
active
059677996
ABSTRACT:
Signal lines and ground lines formed on a major surface of a printed circuit board are electrically connected to signal lines and ground lines on a major surface of a flexible printed circuit film opposed to the major surface of the printed circuit board through a stacking connector, a conductive coupling member and another conductive coupling member are attached to a first ground pattern formed on the major surface of the printed circuit board and a second ground pattern formed on the reverse surface of the flexible printed circuit film, and the conductive coupling members are engaged with each other so as to provide a bypass of the conductive paths in the stacking connector for the ground lines and a shield against electro-magnetic noise radiated from the stacking connector.
REFERENCES:
patent: 5186632 (1993-02-01), Horton et al.
patent: 5199884 (1993-04-01), Kaufman et al.
patent: 5556286 (1996-09-01), Ikesugi et al.
Japenese Office Action, dated Jan. 19, 1999, with English language translation of Japenese Examiner's comments.
Bradley Paula
Davis Katrina
NEC Corporation
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