Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2006-06-30
2009-10-20
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S734000, C257S783000, C257S792000, C257SE23007, C257SE23067, C257SE23119, C977S761000, C977S762000, C977S766000, C977S770000, C977S778000
Reexamination Certificate
active
07605474
ABSTRACT:
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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Chen Yu Chih
Cheng Syh Yuh
Lin Ren Jen
Uang Ruoh Huey
Bacon & Thomas PLLC
Clark Jasmine J
Industrial Technology Research Institute
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