Structure of ohmic electrode for semiconductor by atomic layer d

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257 76, 257473, 257615, 257764, 257767, H01L 2348, H01L 310257, H01L 27095, H01L 2920

Patent

active

057931097

ABSTRACT:
An ohmic contact electrode for a semiconductor device which has a low contact resistance and high stability. The ohmic contact electrode includes: a semiconductor substrate; an atomic doping layer developed on the semiconductor substrate wherein the atomic doping layer is formed by doping impurities such that an energy level of the layer is higher than a Fermi level; a semiconductor layer developed on the atomic doping layer wherein the semiconductor layer is formed of the same material as in the semiconductor substrate; a metal electrode formed on the semiconductor layer for establishing an electric connection with the semiconductor substrate; wherein the semiconductor layer has a thickness sufficient for carriers to transfer between the metal electrode and the atomic doping layer by tunneling through the semiconductor layer.

REFERENCES:
patent: 5399886 (1995-03-01), Hasegawa
patent: 5610410 (1997-03-01), Imanishi

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