Structure of mounting a semiconductor element onto a substrate

Details Structure of mounting a semiconductor element onto a substrate Structure of mounting a semiconductor element onto a substrate

1997-06-20

2000-05-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361751, 257778, 257787, 257788, 174260, 22818022, 438616, 29840, 29841, H05K 330

Patent

active

060580216

ABSTRACT:
A semiconductor element/substrate mounting structure is formed by a first step of covering a resin film over the substrate together with a conductive portion; a second step of pressing and heating so that bumps penetrate through the resin film to come into contact with the conductive portion; and a third step of pressing and heating so that the bumps and the conductive portion become alloyed between the semiconductor element and the substrate.

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