Structure of lead terminal of electronic device

Details Structure of lead terminal of electronic device Structure of lead terminal of electronic device

1992-07-27

1993-12-14

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 361772, 361773, 361774, H01L 2302, H01R 900

Patent

active

052704920

ABSTRACT:
A small bore or a cut portion is formed in a leading end portion of a lead terminal extended from a package main body. A gas produced when the leading end portion is contacted with and soldered to a land provided on a printed wiring board is allowed to escape through the small bore or the cut portion and, therefore, solder is easy to enter between the lead terminal and the land, which improves the soldering performance of the lead terminal. Also, the provision of the small bore or cut portion increases the area of a peripheral portion of the lead terminal to be in contact with the solder to thereby increasing the strength of the soldering.

REFERENCES:
patent: 4991059 (1991-02-01), Kiyose

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