Structure of joining printed circuit boards and process for prod

Details Structure of joining printed circuit boards and process for prod Structure of joining printed circuit boards and process for prod

1986-03-27

1989-01-03

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228254, 174 88R, 439485, 439876, H05K 324

Patent

active

047950790

ABSTRACT:
A structure of joining two printed circuit boards with solder. A reserve solder layer is applied on a pattern of first joint leads of the printed circuit on a base plate of the first board. A pattern of high thermal conductivity similar to the pattern of second joint leads of the second printed circuit board, is formed on the opposite or back surface of the base plate thereof substantially superposed with the second joint leads. To join the first and second boards, the second board is turned upside down and then the second joint lead pattern is put on the solder layer in registry with the first joint lead pattern of the first board. And it is at a point on each patch of the thermal conductivity pattern that heat is then applied thereto to obtain the structure between the joint leads of the two printed circuit boards.

REFERENCES:
patent: 3374531 (1968-03-01), Bruce
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4657172 (1987-04-01), Lee

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