Structure of heat conductive plate

Details Structure of heat conductive plate Structure of heat conductive plate

2006-04-25

2006-04-25

McKinnon, Terrell (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104330, C361S700000, C257S715000, C174S015200

Reexamination Certificate

active

07032652

ABSTRACT:
A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.

REFERENCES:
patent: 3680189 (1972-08-01), Noren
patent: 4046190 (1977-09-01), Marcus et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 6056044 (2000-05-01), Benson et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6227287 (2001-05-01), Tanaka et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6477045 (2002-11-01), Wang
patent: 6679318 (2004-01-01), Bakke
patent: 6901994 (2005-06-01), Jin-Cherng et al.
patent: 6957692 (2005-10-01), Win-Haw et al.
patent: 2003/0121645 (2003-07-01), Wang
patent: 2004/0069455 (2004-04-01), Lindemuth et al.
patent: 58-96992 (1983-06-01), None
patent: 6-112380 (1994-04-01), None
patent: 11-193994 (1999-07-01), None
patent: 2001-255085 (2001-09-01), None
patent: 2001-339026 (2001-12-01), None
patent: 2002-62067 (2002-02-01), None

Affiliated with

Also associated with

Rating

Structure of heat conductive plate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure of heat conductive plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure of heat conductive plate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3529396