Structure of embedded active components and manufacturing...

Details Structure of embedded active components and manufacturing... Structure of embedded active components and manufacturing...

2009-03-18

2011-11-01

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE23020, C257S774000, C257S786000, C438S109000, C438S612000

Reexamination Certificate

active

08048716

ABSTRACT:
A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.

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