Structure of electronic parts and method of soldering electronic

Details Structure of electronic parts and method of soldering electronic Structure of electronic parts and method of soldering electronic

1996-04-10

1999-04-20

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

257787, H01L 2328

Patent

active

058949844

ABSTRACT:
An improved structure of an electronic part with solder bumps is provided. The electronic part includes, for example, an IC chip and a board. The solder bumps are disposed on the bottom surface of the board and have a melting point greater than a thermal deformation temperature of the board. With this arrangement, if the curved board is bonded to a substrate in a soldering process, the solder bumps are solidified at a higher temperature than the thermal deformation temperature of the board during a cooling process, thereby preventing the curved board which has been straightened once above the thermal deformation temperature from being returned to its original shape. Several modifications are disclosed.

REFERENCES:
patent: 5154341 (1992-10-01), Melton et al.
patent: 5282565 (1994-02-01), Melton
patent: 5470787 (1995-11-01), Greer
patent: 5535101 (1996-07-01), Miles et al.
patent: 5565709 (1996-10-01), Fukushima et al.

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