Structure of electrically heatable body attached to a mold that

Details Structure of electrically heatable body attached to a mold that Structure of electrically heatable body attached to a mold that

1996-07-26

1997-08-12

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Preform assembly means and means for bonding of plural...

Reshaping means utilizing fluid pressure directly contacting...

156212, 156510, 156530, 264163, 425289, 425388, 425510, B29C 5132

Patent

active

056563060

ABSTRACT:
A mold assembly is disclosed that has an electrically heatable body, that glues and trims a film, and that minimizes the heat loss of the heatable body. The mold assembly includes a receiving mold (2) formed on the upper part of a frame (1), a non-current-conductive and heat-resistive material (11) disposed at the periphery of the receiving mold and having vertical throughbores (14), an electrically heatable body (5) extending along the throughbores, and metal holders (12) disposed in the throughbores (14) to hold the electrically heatable body (5) in a non-contact relation with the heat resistive material (11) at least at the positions where the holders are.

REFERENCES:
patent: 3135077 (1964-06-01), Siegel et al.
patent: 3273203 (1966-09-01), Ross
patent: 3294881 (1966-12-01), Wadlinger

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